JPH0445262Y2 - - Google Patents
Info
- Publication number
- JPH0445262Y2 JPH0445262Y2 JP1988106487U JP10648788U JPH0445262Y2 JP H0445262 Y2 JPH0445262 Y2 JP H0445262Y2 JP 1988106487 U JP1988106487 U JP 1988106487U JP 10648788 U JP10648788 U JP 10648788U JP H0445262 Y2 JPH0445262 Y2 JP H0445262Y2
- Authority
- JP
- Japan
- Prior art keywords
- external connection
- leads
- sealing body
- bent
- pitch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988106487U JPH0445262Y2 (en]) | 1988-08-10 | 1988-08-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988106487U JPH0445262Y2 (en]) | 1988-08-10 | 1988-08-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0227756U JPH0227756U (en]) | 1990-02-22 |
JPH0445262Y2 true JPH0445262Y2 (en]) | 1992-10-23 |
Family
ID=31340047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988106487U Expired JPH0445262Y2 (en]) | 1988-08-10 | 1988-08-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0445262Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50123256U (en]) * | 1974-03-14 | 1975-10-08 |
-
1988
- 1988-08-10 JP JP1988106487U patent/JPH0445262Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPH0227756U (en]) | 1990-02-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH11145323A (ja) | 半導体装置およびその製造方法 | |
JPH0570316B2 (en]) | ||
JP2021524591A (ja) | 一次導体が一体化された電流変換器 | |
JP2002217354A (ja) | 半導体装置 | |
JPH0445262Y2 (en]) | ||
US5227761A (en) | Magnetoresistive sensor | |
JP2686568B2 (ja) | 光学装置 | |
JP3627719B2 (ja) | 熱電モジュール | |
JPH06821Y2 (ja) | 半導体装置の実装構造 | |
JP3423881B2 (ja) | チップインダクタおよびその製造方法 | |
JPH0821668B2 (ja) | 立設実装形半導体装置 | |
JP2964781B2 (ja) | 半導体装置 | |
JP2516820Y2 (ja) | 磁気センサー | |
JPH03261153A (ja) | 半導体装置用パッケージ | |
JP2652222B2 (ja) | 電子部品搭載用基板 | |
JPS58171683A (ja) | 磁気センサ装置 | |
JPH02134857A (ja) | 半導体装置 | |
JPH01132147A (ja) | 半導体装置 | |
JP2711116B2 (ja) | 磁気抵抗素子 | |
JP2784209B2 (ja) | 半導体装置 | |
JP2014063767A (ja) | 配線基板およびそれを用いた半導体装置 | |
JPH05251513A (ja) | 半導体装置 | |
JPH0543994B2 (en]) | ||
JPH0297042A (ja) | 電子部品搭載用基板 | |
JPH04367289A (ja) | ホール素子およびホール素子の製造方法 |